Free shipping on all orders in the USA!

Handbook of 3D Integration, Volume 3: 3D Process Technology

ISBN: 9783527334667
Publisher: Wiley-VCH
Edition: 1
Publication Date: 2014-07-21
Number of pages: 474
  • Sale
  • Regular price $97.01

Any used item that originally included an accessory such as an access code, one time use worksheet, cd or dvd, or other one time use accessories may not be guaranteed to be included or valid. By purchasing this item you acknowledge the above statement.

Description


Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology.
Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

Customer Reviews


MORE FROM THIS COLLECTION